Low pressure molding (LPM) material for protecting printed circuit boards and electronic components
- Waterproof
- Dustproof
- Productivity
improvement - Environment
friendly
What is VYLOSHOT®?
Three features of VYLOSHOT® for Low pressure molding
There are
There are
types ofVYLOSHOT®
types of VYLOSHOT®
▼Scroll sideways to see the table below
| Thermoplastic type | Thermoset type | |
| Shape of resin | Pellet | Granule |
| Injection machine uses | ○ | ○ |
| Injection temperature | 170～240℃ | 70～90℃ |
| Mold temperature | 25～40℃ (Cooling) | 150～180℃ (Curing) |
| Cooling time Curing time |
20～60s (Cooling) | 20～60s (Curing) |
| Takt time | 30～90s | 30～90s |
VYLOSHOT® (thermoplastic type) is
high flexible co-polyester
resin that can be molded at low temperature and pressure.
Compared to general plastic material, VYLOSHOT® can be molded at low temperature and pressure.
VYLOSHOT® (thermoset type) is high modulus and low linear expansion
arylate resin that can be molded at low temperature and pressure.
Advantages over transfer epoxy resin
- Storage : Below 40℃
- Retention stability : Good
- After cure : Unnecessary
- Molding machine : Can be used with general thermoset injection molding machines
Support system
We provide total support with "materials and solutions" from resin development to mold production, prototyping, and mass production support.
Total solution system
- Evaluation and analysis support
- Resin development
- Design support
- Prototype mold design support
- Prototype follow-up
- Mold production support
- Mass production support
- Equipment proposal
- Support globally
Features of VYLOSHOT®
LPM process enables a caseless design because no case is required when injecting the liquid potting material.
5 features of low pressure molding
Less damage to electric parts
by low pressure molding
Contribute to downsizing・thin-wall・weight saving
Reduce volume of resin and number of components
Resin in pellet shape is easy to handle
Small scale molding machine makes in-lining possible
Less damage to electric parts by low pressure molding
VYLOSHOT®'s good flowability provides "Gentle Encapsulation" with minimum damages of electronic components.
Contribute to downsizing・thin-wall・weight saving
The amount of resin required for encapsulation can be reduced.
Reduce volume of resin and number of components
LPM process enables a caseless design.
Resin in pellet shape is easy to handle
No need for liquid management like potting.
Small scale molding machine makes in-lining possible
By using small equipment, the molding process can be integrated into the assembly process and put in-line.
Examples
Can be applied to components of various shapes.
▼Scroll sideways to see the table below
| Type of molding | Features | Applications | Image |
|---|---|---|---|
| Over molding (entire sealing) |
|
|
 |
| One side molding |
|
|
 |
| Partially molding |
|
・PCB |  |
| Resin injection into the case (Similar to Potting) |
|
Sensor |  |
| Connection point of wire Harness |
|
|
 |
| Molding and fixing delicate part |
|
|
 |
Automotive applications
Materials for good adhesion
- PBT, PC, PA66, PPS
- Glass-epoxy circuit, Vinyl covered cord
- PI-film, PET-film
- Tin-plated copper, Nickel-plated copper
Low pressure molding(LPM) process
A shorter process than conventional potting systems
enables enhanced production efficiency
FAQ
What’s the difference between general injection molding and low pressure molding ?
General injection molding focuses on how the product looks — its shape and size. Low pressure molding focuses on how well the material sticks to the part and protects it. Because of this, the way we set the molding conditions is very different.
- What are the advantages of VYLOSHOT® compared to other hot melt materials, such as polyamide-based types ?
- VYLOSHOT® offers superior durability and adhesion compared to polyamide-based hot melts. It demonstrates a significant advantage in demanding automotive environments, such as 85°C / 85% RH for 1000 hours. High-adhesion grades also provide excellent compatibility with a wide range of substrates commonly used in electronic components, enabling greater design flexibility for customers.
Durability of Low pressure molding resin VYLOSHOT
GM-955-R02
GM-955-RK20
GM-960-RK40
Polyamide Hot melt
Adhesive [PBT (GF30%)]
1) Heat cycle resistance
ｰ40°C⇔105°C 30 minute cycle
2) Heat/Humidity resistance
85°C×85％RH
Mechanical properties
Heat/Humidity resistance
85°C×85％RH
- Is special equipment required ?
- In addition to hot melt applicators, standard injection molding machines can also be used. However, machines capable of low-pressure and small-volume control—such as electric types—are recommended. For high adhesive-VYLOSHOT, screw-type injection molding machines or extruders are preferred to maintain performance. Toyobo also offers support regarding molding equipment. Please feel free to contact us
- In what types of applications has VYLOSHOT been adopted ?
- VYLOSHOT has been widely adopted across various fields, primarily in the automotive industry, as well as in off-road vehicles, electronic components, and industrial applications. Please feel free to contact us for more details.
Customer voice
Automotive Tier 1 manufacturer
VYLOSHOT helped us boost productivity and simplify our process. It’s a reliable solution we trust.
Electronic component manufacturer
"Low pressure molding reduced stress on electronic components, helping us cut down on defects during production."
Customer voice
Total support through materials and solutions. Feel free to contact us.
Please feel free to contact us
TOYOBO MC Corporation TOYOBO STC CO,LTD.